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"Thermomechanical stress analysis of Cu/low-k dielectric interconnect schemes."

Alan Mathewson, Carlos Montes de Oca, Sean Foley (2001)

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DOI: 10.1016/S0026-2714(01)00160-3

access: closed

type: Journal Article

metadata version: 2020-02-22

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Alan Mathewson, Carlos Montes de Oca, Sean Foley:
Thermomechanical stress analysis of Cu/low-k dielectric interconnect schemes. Microelectron. Reliab. 41(9-10): 1637-1641 (2001)

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