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"A new approach to the dynamic thermal modelling of semiconductor packages."

F. N. Masana (2001)

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DOI: 10.1016/S0026-2714(01)00013-0

access: closed

type: Journal Article

metadata version: 2020-02-22

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F. N. Masana:
A new approach to the dynamic thermal modelling of semiconductor packages. Microelectron. Reliab. 41(6): 901-912 (2001)

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