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"Defect and microstructural evolution in thermally cycled Cu ..."

James Marro et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.05.007

access: closed

type: Journal Article

metadata version: 2022-01-31

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James Marro, Chukwudi Okoro, Yaw S. Obeng, Kathleen A. Richardson:
Defect and microstructural evolution in thermally cycled Cu through-silicon vias. Microelectron. Reliab. 54(11): 2586-2593 (2014)

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