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"Stacked solder bumping technology for improved solder joint reliability."
Xingsheng Liu et al. (2001)
- Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard:
Stacked solder bumping technology for improved solder joint reliability. Microelectron. Reliab. 41(12): 1979-1992 (2001)
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