"Evaluating board level solder interconnects reliability using vibration ..."

Yang Liu et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.07.058

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type: Journal Article

metadata version: 2020-02-22

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Yang Liu, Fenglian Sun, Hongwu Zhang, J. Wang, Zhen Zhou:
Evaluating board level solder interconnects reliability using vibration test methods. Microelectron. Reliab. 54(9-10): 2053-2057 (2014)

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