"Copper interconnect electromigration behaviors in various structures and ..."

M. H. Lin et al. (2005)

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DOI: 10.1016/J.MICROREL.2004.11.055

access: closed

type: Journal Article

metadata version: 2020-02-22

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M. H. Lin, Y. L. Lin, K. P. Chang, K. C. Su, Tahui Wang:
Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment. Microelectron. Reliab. 45(7-8): 1061-1078 (2005)

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