"Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni ..."

Chi-Pu Lin, Chih-Ming Chen (2012)

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DOI: 10.1016/J.MICROREL.2011.03.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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Chi-Pu Lin, Chih-Ming Chen:
Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations. Microelectron. Reliab. 52(2): 385-390 (2012)

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