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"Surface roughness effect on copper-alumina adhesion."

Ju Dy Lim et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.07.016

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/LimYRLW13
Ju Dy Lim, Susan Yeow Su Yi, MinWoo Daniel Rhee, Kam Chew Leong, Chee Cheong Wong:
Surface roughness effect on copper-alumina adhesion. Microelectron. Reliab. 53(9-11): 1548-1552 (2013)

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