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"Comparison of power cycling reliability of flexible PCB interconnect ..."

Jianfeng Li, Jingru Dai, Christopher Mark Johnson (2018)

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DOI: 10.1016/J.MICROREL.2018.03.013

access: open

type: Journal Article

metadata version: 2021-10-14

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Jianfeng Li, Jingru Dai, Christopher Mark Johnson:
Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints. Microelectron. Reliab. 84: 55-65 (2018)

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