"Electromigration challenges for advanced on-chip Cu interconnects."

Baozhen Li et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.01.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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Baozhen Li, Cathryn Christiansen, Dinesh Badami, Chih-Chao Yang:
Electromigration challenges for advanced on-chip Cu interconnects. Microelectron. Reliab. 54(4): 712-724 (2014)

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