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"Evolution of microstructure and failure mechanism of lead-free solder ..."

Tomi Laurila et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.07.095

access: closed

type: Journal Article

metadata version: 2022-03-03

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Tomi Laurila, Toni T. Mattila, Vesa Vuorinen, Juha Karppinen, Jue Li, Mika Sippola, Jorma K. Kivilahti:
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests. Microelectron. Reliab. 47(7): 1135-1144 (2007)

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