Stop the war!
Остановите войну!
for scientists:
default search action
"Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic ..."
Tomi Laurila et al. (2009)
- Tomi Laurila, J. Hurtig, Vesa Vuorinen, Jorma K. Kivilahti:
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers. Microelectron. Reliab. 49(3): 242-247 (2009)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.