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"Optimization modeling of the cooling stage of reflow soldering process for ..."

Chun-Sean Lau, Mohd Zulkifly Abdullah, F. Che Ani (2012)

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DOI: 10.1016/J.MICROREL.2012.01.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Chun-Sean Lau, Mohd Zulkifly Abdullah, F. Che Ani:
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method. Microelectron. Reliab. 52(6): 1143-1152 (2012)

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