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"Evaluation of solder joint strengths under ball impact test."

Yi-Shao Lai, Hsiao-Chuan Chang, Chang-Lin Yeh (2007)

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DOI: 10.1016/J.MICROREL.2006.11.015

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yi-Shao Lai, Hsiao-Chuan Chang, Chang-Lin Yeh:
Evaluation of solder joint strengths under ball impact test. Microelectron. Reliab. 47(12): 2179-2187 (2007)

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