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"Deformation mechanism and its effect on electrical conductivity of ACF ..."

Woon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik (2006)

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DOI: 10.1016/J.MICROREL.2005.06.014

access: closed

type: Journal Article

metadata version: 2020-02-22

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Woon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik:
Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study. Microelectron. Reliab. 46(2-4): 589-599 (2006)

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