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"Evaluation of sweep resistance of Q Auto-Loop and Square-Loop bonds for ..."

Huang-Kuang Kung (2007)

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DOI: 10.1016/J.MICROREL.2006.07.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Huang-Kuang Kung:
Evaluation of sweep resistance of Q Auto-Loop and Square-Loop bonds for semiconductor packaging technology. Microelectron. Reliab. 47(7): 1103-1112 (2007)

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