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"Impact of via density and passivation thickness on the mechanical ..."
Luka Kljucar et al. (2017)
- Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne
, Zsolt Tökei
:
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. Microelectron. Reliab. 79: 297-305 (2017)
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