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"Investigation of moisture-induced failures of stacked-die package."

Hak Sung Kim, Ho Geon Song (2007)

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DOI: 10.1016/J.MICROREL.2007.07.014

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hak Sung Kim, Ho Geon Song:
Investigation of moisture-induced failures of stacked-die package. Microelectron. Reliab. 47(9-11): 1673-1679 (2007)

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