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"The formation and growth of intermetallic compounds and shear strength at ..."

Kyung-Seob Kim et al. (2005)

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DOI: 10.1016/J.MICROREL.2004.07.005

access: closed

type: Journal Article

metadata version: 2023-08-31

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Kyung-Seob Kim, K. W. Ryu, C. H. Yu, J. M. Kim:
The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces. Microelectron. Reliab. 45(3-4): 647-655 (2005)

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