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"Characterization of materials and their interfaces in a direct bonded ..."

A. Ben Kabaar et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.06.001

access: closed

type: Journal Article

metadata version: 2021-05-19

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  - journals/mr/KabaarBDEGG17
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  - https://dblp.org/rec/journals/mr/KabaarBDEGG17
A. Ben Kabaar, Cyril Buttay, O. Dezellus, R. Estevez, Anthony Gravouil, Laurent Gremillard:
Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications. Microelectron. Reliab. 79: 288-296 (2017)

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