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"Thermal characterizations of Cu nanoparticle joints for power ..."

Toshitaka Ishizaki et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.07.042

access: closed

type: Journal Article

metadata version: 2022-04-01

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Toshitaka Ishizaki, T. Satoh, A. Kuno, A. Tane, Masashi Yanase, F. Osawa, Yasushi Yamada:
Thermal characterizations of Cu nanoparticle joints for power semiconductor devices. Microelectron. Reliab. 53(9-11): 1543-1547 (2013)

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