"Study of the effect of reflow time and temperature on Cu-Sn intermetallic ..."

Wei Huang, James M. Loman, Bülent Sener (2002)

> Home

Details and statistics

DOI: 10.1016/S0026-2714(02)00090-2

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/HuangLS02
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/HuangLS02
Wei Huang, James M. Loman, Bülent Sener:
Study of the effect of reflow time and temperature on Cu-Sn intermetallic compound layer reliability. Microelectron. Reliab. 42(8): 1229-1234 (2002)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.