"Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to ..."

Xiaowu Hu et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.04.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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Xiaowu Hu, Yulong Li, Yong Liu, Yi Liu, Zhixian Min:
Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging. Microelectron. Reliab. 54(8): 1575-1582 (2014)

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