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"Development of chip-on-flex bonding using Sn-based bumps and ..."
Kyoung-Moo Harr et al. (2015)
- Kyoung-Moo Harr, Sun-Chul Kim, Young-Min Kim, Young-Ho Kim:
Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive. Microelectron. Reliab. 55(8): 1241-1247 (2015)
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