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"Enhancing the microstructure and tensile creep resistance of ..."

A. E. Hammad, A. A. Ibrahiem (2017)

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DOI: 10.1016/J.MICROREL.2017.07.034

access: closed

type: Journal Article

metadata version: 2020-10-26

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  - https://dblp.org/rec/journals/mr/HammadI17
A. E. Hammad, A. A. Ibrahiem:
Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles. Microelectron. Reliab. 75: 187-194 (2017)

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