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"Prediction of thermo-mechanical integrity of wafer backend processes."
Viktor Gonda et al. (2004)
- Viktor Gonda
, Jaap M. J. den Toonder
, Johan Beijer, G. Q. Zhang, Willem D. van Driel, Romano J. O. M. Hoofman, Leo J. Ernst:
Prediction of thermo-mechanical integrity of wafer backend processes. Microelectron. Reliab. 44(12): 2011-2017 (2004)
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