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"Growth mechanism of intermetallic compounds and damping properties of ..."

Asit Kumar Gain, Y. C. Chan (2014)

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DOI: 10.1016/J.MICROREL.2014.01.026

access: closed

type: Journal Article

metadata version: 2020-02-22

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Asit Kumar Gain, Y. C. Chan:
Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO₂ composite solders. Microelectron. Reliab. 54(5): 945-955 (2014)

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