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"Analytical stress characterization after different chip separation methods."

M. Fuegl et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.07.086

access: closed

type: Journal Article

metadata version: 2020-02-22

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M. Fuegl, G. Mackh, Elke Meissner, Lothar Frey:
Analytical stress characterization after different chip separation methods. Microelectron. Reliab. 54(9-10): 1735-1740 (2014)

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