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"Drop impact reliability of edge-bonded lead-free chip scale packages."

Andrew Farris et al. (2009)

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DOI: 10.1016/J.MICROREL.2009.05.003

access: closed

type: Journal Article

metadata version: 2022-11-07

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  - https://dblp.org/rec/journals/mr/FarrisPLKVTMSBWG09
Andrew Farris, Jianbiao Pan, Albert A. Liddicoat, Michael Krist, Nicholas A. Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger:
Drop impact reliability of edge-bonded lead-free chip scale packages. Microelectron. Reliab. 49(7): 761-770 (2009)

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