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ORCID"Quantification of cracked area in thermal path of high-power multi-chip ..."
Mohd. Amir Eleffendi et al. (2016)
- Mohd. Amir Eleffendi, Li Yang, Pearl A. Agyakwa
, C. Mark Johnson:
Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement. Microelectron. Reliab. 59: 73-83 (2016)
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