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"Simulation based analysis of secondary effects on solder fatigue."

Rainer Dudek et al. (2009)

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DOI: 10.1016/J.MICROREL.2009.03.014

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/DudekDBM09
Rainer Dudek, Ralf Döring, Christine Bombach, Bernd Michel:
Simulation based analysis of secondary effects on solder fatigue. Microelectron. Reliab. 49(8): 839-845 (2009)

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