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"Prediction and verification of process induced warpage of electronic packages."

W. D. van Driel et al. (2003)

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DOI: 10.1016/S0026-2714(03)00057-X

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/DrielZJESCY03
W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi:
Prediction and verification of process induced warpage of electronic packages. Microelectron. Reliab. 43(5): 765-774 (2003)

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