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"Prediction of Delamination Related IC & Packaging Reliability Problems."

W. D. van Driel et al. (2005)

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DOI: 10.1016/J.MICROREL.2005.07.065

access: closed

type: Journal Article

metadata version: 2022-05-18

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W. D. van Driel, Marcel A. J. van Gils, Richard B. R. van Silfhout, G. Q. Zhang:
Prediction of Delamination Related IC & Packaging Reliability Problems. Microelectron. Reliab. 45(9-11): 1633-1638 (2005)

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