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"Study of the UBM to copper interface robustness of solder bumps in flip ..."

Jörg Dreybrodt, Yves Dupraz (2014)

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DOI: 10.1016/J.MICROREL.2014.07.114

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jörg Dreybrodt, Yves Dupraz:
Study of the UBM to copper interface robustness of solder bumps in flip chip packages. Microelectron. Reliab. 54(9-10): 1969-1971 (2014)

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