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"High temperature induced failure in Ti/Al/Ni/Au Ohmic contacts on ..."

Zhihua Dong et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.09.021

access: closed

type: Journal Article

metadata version: 2023-09-30

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  - https://dblp.org/rec/journals/mr/DongWWLGYHXSW12
Zhihua Dong, Jinyan Wang, Cheng P. Wen, Shenghou Liu, Rumin Gong, Min Yu, Yilong Hao, Fujun Xu, Bo Shen, Yangyuan Wang:
High temperature induced failure in Ti/Al/Ni/Au Ohmic contacts on AlGaN/GaN heterostructure. Microelectron. Reliab. 52(2): 434-438 (2012)

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