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"Fatigue measurement setup under combined thermal and vibration loading on ..."

Karsten M. Decker et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.06.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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Karsten M. Decker, René M. Rehmann, Mike Roellig, Karlheinz Bock:
Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly. Microelectron. Reliab. 87: 125-132 (2018)

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