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"Investigation of stress distribution in via bottom of Cu-via structures ..."

Joharsyah Ciptokusumo, Kirsten Weide-Zaage, Oliver Aubel (2009)

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DOI: 10.1016/J.MICROREL.2009.07.043

access: closed

type: Journal Article

metadata version: 2020-02-22

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Joharsyah Ciptokusumo, Kirsten Weide-Zaage, Oliver Aubel:
Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling. Microelectron. Reliab. 49(9-11): 1090-1095 (2009)

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