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"Warpage simulation for the reconstituted wafer used in fan-out wafer level ..."

Tz-Cheng Chiu, En-Yu Yeh (2018)

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DOI: 10.1016/J.MICROREL.2017.11.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tz-Cheng Chiu, En-Yu Yeh:
Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging. Microelectron. Reliab. 80: 14-23 (2018)

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