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"Heat dissipation assessment of through silicon via (TSV)-based 3D IC ..."

Hsien-Chie Cheng et al. (2016)

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DOI: 10.1016/J.MICROREL.2015.12.028

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hsien-Chie Cheng, Tzu-Chin Huang, Po-Wen Hwang, Wen-Hwa Chen:
Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing. Microelectron. Reliab. 59: 84-94 (2016)

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