"Effect of polyimide baking on bump resistance in flip-chip solder joints."

Hsi-Kuei Cheng et al. (2014)

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DOI: 10.1016/J.MICROREL.2013.11.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hsi-Kuei Cheng, Shien-Ping Feng, Yi-Jen Lai, Kuo-Chio Liu, Ying-Lang Wang, Tzeng-Feng Liu, Chih-Ming Chen:
Effect of polyimide baking on bump resistance in flip-chip solder joints. Microelectron. Reliab. 54(3): 629-632 (2014)

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