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"Wirebonding at higher ultrasonic frequencies: reliability and process ..."

Harry K. Charles Jr. et al. (2003)

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DOI: 10.1016/S0026-2714(02)00118-X

access: closed

type: Journal Article

metadata version: 2020-02-22

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Harry K. Charles Jr., K. J. Mach, S. J. Lehtonen, Arthur S. Francomacaro, J. S. DeBoy, R. L. Edwards:
Wirebonding at higher ultrasonic frequencies: reliability and process implications. Microelectron. Reliab. 43(1): 141-153 (2003)

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