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"Non-destructive degradation study of copper wire bond for its temperature ..."

Marvin Chan et al. (2016)

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DOI: 10.1016/J.MICROREL.2015.12.026

access: closed

type: Journal Article

metadata version: 2021-10-14

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Marvin Chan, Cher Ming Tan, Kheng Chooi Lee, Chuan Seng Tan:
Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation. Microelectron. Reliab. 61: 56-63 (2016)

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