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"A novel soldering method to evaluate PCB pad cratering for pin-pull testing."

Miao Cai et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.07.025

access: closed

type: Journal Article

metadata version: 2020-02-22

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Miao Cai, D. J. Xie, W. B. Chen, B. Y. Wu, Dao-Guo Yang, G. Q. Zhang:
A novel soldering method to evaluate PCB pad cratering for pin-pull testing. Microelectron. Reliab. 53(9-11): 1568-1574 (2013)

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