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"Measurement of stresses in Cu and Si around through-silicon via by ..."

Arief Suriadi Budiman et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.10.016

access: closed

type: Journal Article

metadata version: 2023-02-10

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Arief Suriadi Budiman, H.-A.-S. Shin, B.-J. Kim, S.-H. Hwang, Ho-Young Son, Min-Suk Suh, Q.-H. Chung, K.-Y. Byun, Nobumichi Tamura, Martin Kunz, Young-Chang Joo:
Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits. Microelectron. Reliab. 52(3): 530-533 (2012)

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