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"Acceleration of the growth of Cu₃Sn voids in solder joints."

Peter Borgesen, Liang Yin, Pericles Kondos (2012)

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DOI: 10.1016/J.MICROREL.2011.12.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/BorgesenYK12
Peter Borgesen, Liang Yin, Pericles Kondos:
Acceleration of the growth of Cu₃Sn voids in solder joints. Microelectron. Reliab. 52(6): 1121-1127 (2012)

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