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"Solder joint reliability under realistic service conditions."

Peter Borgesen et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.07.091

access: closed

type: Journal Article

metadata version: 2022-05-23

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Peter Borgesen, S. Hamasha, Mazin Obaidat, V. Raghavan, X. Dai, Michael Meilunas, M. Anselm:
Solder joint reliability under realistic service conditions. Microelectron. Reliab. 53(9-11): 1587-1591 (2013)

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