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"Reliability of thick Al wire: A study of the effects of wire bonding ..."

Elaheh Arjmand, Pearl A. Agyakwa, C. Mark Johnson (2014)

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DOI: 10.1016/J.MICROREL.2014.07.119

access: closed

type: Journal Article

metadata version: 2022-10-02

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Elaheh Arjmand, Pearl A. Agyakwa, C. Mark Johnson:
Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods. Microelectron. Reliab. 54(9-10): 2006-2012 (2014)

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