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"Effects of the intermetallic compound microstructure on the tensile ..."

Tong An, Fei Qin (2014)

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DOI: 10.1016/J.MICROREL.2014.01.008

access: open

type: Journal Article

metadata version: 2020-02-22

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Tong An, Fei Qin:
Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates. Microelectron. Reliab. 54(5): 932-938 (2014)

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