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"Failure study of Sn37Pb PBGA solder joints using temperature cycling, ..."

Tong An et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.10.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tong An, Chao Fang, Fei Qin, Huaicheng Li, Tao Tang, Pei Chen:
Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests. Microelectron. Reliab. 91: 213-226 (2018)

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