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"Mechanical characterization of Sn-Ag-based lead-free solders."

Masazumi Amagai et al. (2002)

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DOI: 10.1016/S0026-2714(02)00017-3

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - journals/mr/AmagaiWOKS02
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  - https://dblp.org/rec/journals/mr/AmagaiWOKS02
Masazumi Amagai, Masako Watanabe, Masaki Omiya, Kikuo Kishimoto, Toshikazu Shibuya:
Mechanical characterization of Sn-Ag-based lead-free solders. Microelectron. Reliab. 42(6): 951-966 (2002)

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